The EzLaze Laser Cutting System is optimized for semiconductor failure analysis, design verification and Liquid Crystal Display (LCD) or Flat Panel Display (FPD) repair.

EzLaze 3

The tool is able to be mounted on most major brands of FA microscopes, and allows the user to make precise cuts and selectively remove material on a microscopic scale. 
 
The air-cooled architecture keeps size and weight to a minimum and makes the system practically maintenance-free. 

Main Features

• Air-cooled architecture
  - No cooling water
  - Compact, Lightweight
  - No maintenance required
• Selectable wavelengths allow cutting
  and machining of a wide range of materials:
  - 1064 nm, 532 nm, 355 nm or 266 nm
• 3-axis control of cut size and orientation.
  From 2μm x 2μm (with 100X objective)
  to 50μm x 50μm (with 50X objective).
  Rotation through 180°.
• Simple operation via remote control box
  with a 6.5cm x 7.5cm LCD screen displaying
  menu-based commands or via RS232 interface.
• Precise energy control over a wide range.
• Internal LED spot marker.
• Compatible with most major brands
  of FA microscopes (Mitutoyo, Motic, Seiwa).
• 3 Operating modes:
  - Single shot
  - Continuous (1 Hz)
  - Burst (max. of 10 sec. at 5 Hz).

Standard configuration includes:

• Laser Head
• Standard Energy
• XY Shutter (Std. Resolution)
• Power Supply
• Remote Control
• 2.4m umbilical
• Video spot marker
• Foot switch

Options:

• High Pulse Energy
• Rotating Shutter
• High Resolution Shutter
• Motorized Polarizer
• Horizontal Mount Laser
• Head with Robot-length
• Umbilical
• Internal Spot Marker
• Microscope & Accessories

  Product Data Sheet